Published in
2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021
DOI: 10.1109/ectc32696.2021.00075
Links
Tools
Plasma Activated Low-temperature Die-level Direct Bonding with Advanced Wafer Dicing Technologies for 3D Heterogeneous Integration
Proceedings article published in 2021 by
Katsuyuki Sakuma,
Dishit P. Parekh 
,
Michael Belyansky,
Juan-Manuel Gomez,
Spyridon Skordas,
Dale McHerron,
Isabel De Sousa,
Marc Phaneuf,
Martin M. Desrochers,
Ming Li,
Yiu Ming Cheung,
Siu Cheung So,
So Ying Kwok,
Chun Ho Fan,
Siu Wing Lau
,
Michael Belyansky,
Juan-Manuel Gomez,
Spyridon Skordas,
Dale McHerron,
Isabel De Sousa,
Marc Phaneuf,
Martin M. Desrochers,
Ming Li,
Yiu Ming Cheung,
Siu Cheung So,
So Ying Kwok,
Chun Ho Fan,
Siu Wing Lau
This paper was not found in any repository, but could be made available legally by the author.
Full text: Unavailable
Published version:
archiving forbidden
Data provided by 