Published in
Institute of Electrical and Electronics Engineers, IEEE Microwave and Wireless Components Letters, 1(31), p. 9-12, 2021
DOI: 10.1109/lmwc.2020.3034772
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Compact Low-Loss Chip-to-Waveguide and Chip-to-Chip Packaging Concept Using EBG Structures
Journal article published in 2020 by
Ahmed Hassona 
,
Vessen Vassilev ,
Ashraf Uz Zaman ,
Victor Belitsky ,
Herbert Zirath
,
Vessen Vassilev ,
Ashraf Uz Zaman ,
Victor Belitsky ,
Herbert Zirath
This paper was not found in any repository, but could be made available legally by the author.
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