Published in
American Institute of Physics, Journal of Applied Physics, 8(128), p. 080903, 2020
DOI: 10.1063/5.0013737
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Opportunities and challenges of 2D materials in back-end-of-line interconnect scaling
Journal article published in 2020 by
Chun-Li Lo 
,
Benjamin A. Helfrecht ,
Yanbo He ,
David M. Guzman,
Nicolas Onofrio ,
Shengjiao Zhang,
Dana Weinstein,
Alejandro Strachan ,
Zhihong Chen
,
Benjamin A. Helfrecht ,
Yanbo He ,
David M. Guzman,
Nicolas Onofrio ,
Shengjiao Zhang,
Dana Weinstein,
Alejandro Strachan ,
Zhihong Chen
This paper was not found in any repository, but could be made available legally by the author.
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