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IOP Publishing, Japanese Journal of Applied Physics, 9(59), p. 090905, 2020

DOI: 10.35848/1347-4065/aba9a7

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Self-limiting processes in thermal atomic layer etching of nickel by hexafluoroacetylacetone

Journal article published in 2020 by Abdulrahman Hikmat Basher ORCID, Ikutaro Hamada ORCID, Satoshi Hamaguchi ORCID
This paper is made freely available by the publisher.
This paper is made freely available by the publisher.

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Abstract

Abstract In thermal atomic layer etching (ALE) of Ni, a thin oxidized Ni layer is removed by a hexafluoroacetylacetone (hfacH) etchant gas at an elevated surface temperature, and etching ceases when a metallic Ni surface appears (self-limiting step). However, atomistic details of the self-limiting step was not well understood. With periodic density-functional-theory calculations, it is found that hfacH molecules barrierlessly adsorb and tend to decompose on a metallic Ni surface, in contrast to the case of a NiO surface, where they can form volatile Ni(hfac)2. Our results clarify the origin of the self-limiting process in the thermal ALE.