Published in
2020 IEEE International Reliability Physics Symposium (IRPS), 2020
DOI: 10.1109/irps45951.2020.9128313
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Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects
Proceedings article published in 2020 by
Sarath Mohanachandran Nair,
Rajendra Bishnoi,
Mehdi B. Tahoori,
Houman Zahedmanesh,
Kristof Croes,
Kevin Garello 
,
Gouri Sankar Kar,
Francky Catthoor
,
Gouri Sankar Kar,
Francky Catthoor
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