This paper presents an experimental study on three different capillary structure technologies of heat pipes for application in the thermal management of electronic packaging. The first capillary structure is that of axial grooves manufactured by wire electrical discharge machining (wire-EDM). The sintering process with copper powder produced the second heat pipe. Finally, a hybrid heat pipe was made by the combination of the two previous methods. The heat pipes were produced using copper tubes with an outer diameter of 9.45 mm and a length of 200 mm, and were tested horizontally at increasing heat loads varying from 5 to 35 W. The working fluid used was distilled water. The experimental results showed that all capillary structures for heat pipes worked successfully, so the studied manufacturing methods are suitable. Nonetheless, the hybrid heat pipe is the best, due to the lowest thermal resistance presented.