Published in
Elsevier, Solid-State Electronics, (168), p. 107715, 2020
DOI: 10.1016/j.sse.2019.107715
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Inter-tier electrostatic coupling effects in 3D sequential integration devices and circuits
Journal article published in 2020 by
P. Sideris,
L. Brunet,
L. Ciampolini,
G. Sicard,
P. Batude,
C. Theodorou 
This paper was not found in any repository, but could be made available legally by the author.
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