Published in

MDPI, Crystals, 3(10), p. 173, 2020

DOI: 10.3390/cryst10030173

Links

Tools

Export citation

Search in Google Scholar

Mechanical, Dielectric, and Thermal Attributes of Polyimides Stemmed Out of 4, 4’–Diaminodiphenyl Ether

Journal article published in 2020 by Panpan Zhang, Ke Zhang, Shuliang Dou, Jiupeng Zhao, Xiangqiao Yan, Yao Li ORCID
This paper is made freely available by the publisher.
This paper is made freely available by the publisher.

Full text: Download

Green circle
Preprint: archiving allowed
Green circle
Postprint: archiving allowed
Green circle
Published version: archiving allowed
Data provided by SHERPA/RoMEO

Abstract

Several kinds of polyimide (PI) films stemmed out of 4, 4’–diaminodiphenyl ether, as well as various structurally various aromatic dianhydride, were prepared. The films’ mechanical, dielectric, and dynamic mechanical attributes were put under investigation. According the findings, the PI films’ performance is significantly different as a result of their diverse structure. PI’s dielectric constant and dielectric loss tangent of abides by the increasing order below: PMDA-PI>BTDA-PI>BPDA-PI. Moreover, the electric breakdown strength of BTDA-PI (478.90 kV/mm) presents a lot higher value compared to the one PMDA-PI (326.80 kV/mm) and BPDA-PI (357.07 kV/mm). In particular, BTDA-PI film possesses high electric breakdown strength about 478.90 kV/mm. In addition, PI’s glass transition temperature (Tg) are, respectively, 276 °C (BTDA-PI), and 290 °C (BPDA-PI), as well as 302 °C (PMDA-PI). Therefore, in virtue of their various structures and performances, practical applications of PI films can exert significant role in the electronics and microelectronics industries.