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2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2019

DOI: 10.1109/sispad.2019.8870404

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Thermal Conductivity of Silicon Nanowire Using Landauer Approach for Thermoelectric Applications

Proceedings article published in 2019 by Ming-Yi Lee, Min-Hui Chuang, Yiming Li, Seiji Samukawa ORCID
This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

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