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Elsevier, Materials Science in Semiconductor Processing, 4-6(7), p. 283-288, 2004

DOI: 10.1016/j.mssp.2004.09.131

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Expanding thermal plasma for low-k dielectrics : engineering the film chemistry by means of specific dissociation paths in the plasma

This paper is available in a repository.
This paper is available in a repository.

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