Dissemin is shutting down on January 1st, 2025

Published in

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2019

DOI: 10.1109/itherm.2019.8757459

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Optimal Filler Sizes for Thermal Interface Materials

Journal article published in 2019 by Piyas Chowdhury, Kamal Sikka, Alfred Grill, Dishit P. Parekh ORCID
This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

Full text: Unavailable

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