Published in
Elsevier, The Journal of Systems Architecture: Embedded Software Design, (97), p. 397-415, 2019
DOI: 10.1016/j.sysarc.2019.01.003
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A survey of optimization techniques for thermal-aware 3D processors
Journal article published in 2019 by
Kun Cao,
Junlong Zhou,
Tongquan Wei,
Mingsong Chen,
Shiyan Hu,
Keqin Li
This paper was not found in any repository, but could be made available legally by the author.
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