Published in
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), 2019
DOI: 10.23919/ltb-3d.2019.8735257
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Triple-Stacked Wafer-to-Wafer Hybrid Bonding for 3D Structured Image Sensors
Proceedings article published in 2019 by
Yuki Honda,
Masahide Goto,
Toshihisa Watabe,
Masakazu Nanba,
Yoshinori Iguchi,
Takuya Saraya,
Masaharu Kobayashi,
Eiji Higurashi 
,
Hiroshi Toshiyoshi,
Toshiro Hiramoto
,
Hiroshi Toshiyoshi,
Toshiro Hiramoto
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