Published in
2019 International Conference on Electronics Packaging (ICEP), 2019
DOI: 10.23919/icep.2019.8733497
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Room temperature bonding of smooth Au surface of electroformed Cu substrate in atmospheric air
Proceedings article published in 2019 by
Takashi Matsumae,
Michitaka Yamamoto,
Yuichi Kurashima,
Eiji Higurashi 
,
Hideki Takagi
,
Hideki Takagi
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