Published in
2018 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), 2018
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Heat Shunting by Innovative Source/Drain Contact to Enable Monolithic 3D Integration of InGaAs MOSFETs
Proceedings article published in 2018 by
SangHyeon Kim,
Seong Kwang Kim,
SangHoon Shin,
Jae-Hoon Han,
Dae-Myeong Geum,
Jae-Phil Shim,
Subin Lee,
Han Sung Kim 
,
Gunwu Ju,
Jin Dong Song,
Muhammad A. Alam,
Hyung-Jun Kim
,
Gunwu Ju,
Jin Dong Song,
Muhammad A. Alam,
Hyung-Jun Kim
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