Published in
Institute of Electrical and Electronics Engineers, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 1(9), p. 181-188, 2019
DOI: 10.1109/tcpmt.2018.2871764
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High-Thermoresistant Temporary Bonding Technology for Multichip-to-Wafer 3-D Integration With Via-Last TSVs
Journal article published in 2019 by
Hideto Hashiguchi 
,
Takafumi Fukushima ,
Mariappan Murugesan,
Hisashi Kino ,
Tetsu Tanaka,
Mitsumasa Koyanagi
,
Takafumi Fukushima ,
Mariappan Murugesan,
Hisashi Kino ,
Tetsu Tanaka,
Mitsumasa Koyanagi
This paper was not found in any repository, but could be made available legally by the author.
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