Published in
2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018
DOI: 10.1109/icept.2018.8480771
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Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni solder joints
Proceedings article published in 2018 by
Bingfeng Guo,
Ru Huang,
Jinye Yao,
Xiao Qi,
Anil Kunwar 
,
Yunpeng Wang,
Haitao Ma
,
Yunpeng Wang,
Haitao Ma
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