Published in
2018 19th International Conference on Electronic Packaging Technology (ICEPT), 2018
DOI: 10.1109/icept.2018.8480595
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A Numerical Model for Joule heating in Sn Solder Balls of Two Different Sizes
Proceedings article published in 2018 by
Anil Kunwar 
,
Shengyan Shang,
Peter Raback,
Xueguan Song,
Prafulla Bahadur Malla,
Yunpeng Wang,
Haitao Ma
,
Shengyan Shang,
Peter Raback,
Xueguan Song,
Prafulla Bahadur Malla,
Yunpeng Wang,
Haitao Ma
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