Published in
Springer Verlag, Metals and Materials International
DOI: 10.1007/s12540-018-0189-1
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Effect of the $\text {TiO}_2$ TiO 2 Nanoparticles on the Growth Behavior of Intermetallics in Sn/Cu Solder Joints
Journal article published in 2018 by
Shengyan Shang,
Anil Kunwar 
,
Jinye Yao,
Yanfeng Wang,
Haitao Ma ,
Yunpeng Wang
,
Jinye Yao,
Yanfeng Wang,
Haitao Ma ,
Yunpeng Wang
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