Published in
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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Extremely Flexible (1mm Bending Radius) Biocompatible Heterogeneous Fan-Out Wafer-Level Platform with the Lowest Reported Die-Shift (<6 µm) and Reliable Flexible Cu-Based Interconnects
Proceedings article published in 2018 by
Amir Hanna,
Arsalan Alam,
Takafumi Fukushima 
,
Steven Moran,
William Whitehead,
Siva Chandra Jangam,
Saptadeep Pal,
Goutham Ezhilarasu,
Randall Irwin,
Adeel Bajwa,
Subramanian Iyer
,
Steven Moran,
William Whitehead,
Siva Chandra Jangam,
Saptadeep Pal,
Goutham Ezhilarasu,
Randall Irwin,
Adeel Bajwa,
Subramanian Iyer
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