Published in
2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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Evaluation of Chip-Last Fan-Out Panel Level Packaging with G2.5 LCD Facility Using FlexUPTM and Mechanical De-bonding Technologies
Proceedings article published in 2018 by
Wei-Yuan Cheng,
Chen-Tsai Yang,
Jie-Mo Lin,
Wei-Han Chen,
Tai-Jui Wang,
Yuh-Zheng Lee
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