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American Chemical Society, Journal of the American Chemical Society, 6(139), p. 2180-2183, 2017

DOI: 10.1021/jacs.6b12814

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The Power of Packing: Metallization of an Organic Semiconductor

Journal article published in 2017 by Aaron Mailman ORCID, Alicea A. Leitch, Wenjun Yong, Eden Steven, Stephen M. Winter, Robert C. M. Claridge, Abdeljalil Assoud, John S. Tse, Serge Desgreniers, Richard A. Secco, Richard T. Oakley ORCID
Distributing this paper is prohibited by the publisher
Distributing this paper is prohibited by the publisher

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