Published in
Institute of Electrical and Electronics Engineers, IEEE Transactions on Electron Devices, 7(63), p. 2671-2676, 2016
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Thermal Stability Concern of Metal-Insulator-Semiconductor Contact: A Case Study of Ti/TiO2/n-Si Contact
Journal article published in 2016 by
Hao Yu 
,
Marc Schaekers,
Tom Schram ,
Steven Demuynck,
Naoto Horiguchi,
Kathy Barla,
Nadine Collaert,
Aaron Voon-Yew Thean,
Kristin De Meyer
,
Marc Schaekers,
Tom Schram ,
Steven Demuynck,
Naoto Horiguchi,
Kathy Barla,
Nadine Collaert,
Aaron Voon-Yew Thean,
Kristin De Meyer
This paper was not found in any repository, but could be made available legally by the author.
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