Published in

MDPI, Sensors, 7(18), p. 1981

DOI: 10.3390/s18071981

Links

Tools

Export citation

Search in Google Scholar

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Journal article published in 2018 by Pouria Aryan, Santhakumar Sampath ORCID, Hoon Sohn ORCID
This paper is made freely available by the publisher.
This paper is made freely available by the publisher.

Full text: Download

Green circle
Preprint: archiving allowed
Green circle
Postprint: archiving allowed
Green circle
Published version: archiving allowed
Data provided by SHERPA/RoMEO