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Institute of Electrical and Electronics Engineers, IEEE Transactions on Parallel and Distributed Systems, 1(30), p. 146-160, 2019

DOI: 10.1109/tpds.2018.2858230

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Parana: A Parallel Neural Architecture Considering Thermal Problem of 3D Stacked Memory

This paper is made freely available by the publisher.
This paper is made freely available by the publisher.

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