Published in
Institute of Electrical and Electronics Engineers, IEEE Transactions on Components, Packaging, and Manufacturing Technology, 6(8), p. 982-990, 2018
DOI: 10.1109/tcpmt.2018.2826363
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Nondestructive Analysis of Buried Interfacial Behaviors of Flux Residue and Their Impact on Interfacial Mechanical Property
Journal article published in 2018 by
Nathan W. Ulrich 
,
John S. Andre ,
Kunal Khanna ,
Yuying Wei,
Yonghao Xiu,
Zhan Chen
,
John S. Andre ,
Kunal Khanna ,
Yuying Wei,
Yonghao Xiu,
Zhan Chen
This paper was not found in any repository, but could be made available legally by the author.
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