Published in
2018 IEEE International Reliability Physics Symposium (IRPS)
DOI: 10.1109/irps.2018.8353589
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Intra- and inter-chip electrical interconnection formed by directed self assembly of nanocomposite containing diblock copolymer and nanometal
Proceedings article published in 2018 by
M. Murugesan,
T. Fukushima 
,
J. C. Bea,
H. Hashimoto,
M. Koyanagi
,
J. C. Bea,
H. Hashimoto,
M. Koyanagi
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