Published in
Institute of Electrical and Electronics Engineers, IEEE Transactions on Electron Devices, 3(65), p. 1253-1257
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Low-Temperature Material Stacking of Ultrathin Body Ge (110)-on-Insulator Structure via Wafer Bonding and Epitaxial Liftoff From III–V Templates
Journal article published in 2018 by
Jae-Phil Shim 
,
Han-Sung Kim ,
Gunwu Ju,
Hyeong-Rak Lim,
Seong Kwang Kim,
Jae-Hoon Han,
Hyung-Jun Kim,
Sang-Hyeon Kim
,
Han-Sung Kim ,
Gunwu Ju,
Hyeong-Rak Lim,
Seong Kwang Kim,
Jae-Hoon Han,
Hyung-Jun Kim,
Sang-Hyeon Kim
This paper was not found in any repository, but could be made available legally by the author.
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