Published in
Springer (part of Springer Nature), Journal of Materials Science: Materials in Electronics, 6(29), p. 4383-4390
DOI: 10.1007/s10854-017-8428-7
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Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling during multiple reflows
Journal article published in 2018 by
Haoran Ma,
Anil Kunwar 
,
Zhiyuan Liu,
Jun Chen,
Yunpeng Wang,
Mingliang Huang,
Ning Zhao,
Haitao Ma
,
Zhiyuan Liu,
Jun Chen,
Yunpeng Wang,
Mingliang Huang,
Ning Zhao,
Haitao Ma
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