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Towards new plasma technologies for 22nm gate etch processes and beyond
UploadIntegration of a manufacturing grade, k = 2.0 spin-on material in a single damascene structure
Download from www.researchgate.netPorous SiOCH integration: Etch challenges with a trench first metal hard mask approach
UploadEtching mechanisms of thin SiO2 exposed to Cl2 plasma
Download from www.researchgate.netSynchronous Pulsed Plasma for Silicon Etch Applications
Download from www.researchgate.netRoughening of porous SiCOH materials in fluorocarbon plasmas
Download from www.researchgate.netTrigate 6T SRAM scaling to 0.06 µm2
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