Claudio Fontanesi
0000-0002-1183-2406
4 papers found
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Analytic procedure for the evaluation of copper intermetallic diffusion in electroplated gold coatings with energy dispersive X-ray microanalysis
Exploiting the Combination of Displacement and Chemical Plating for a Tailored Electroless Deposition of Palladium Films on Copper
Electrodeposition of Cu on PEDOT for a Hybrid Solid-State Electronic Device
Modelling of the Elementary Steps Involved in the Aluminum Electrochemical Deposition from Ionic Liquid Based Solution: The BMImCl/AlCl3 System
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