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American Chemical Society, ACS Applied Materials and Interfaces, 3(8), p. 2441-2448, 2016

DOI: 10.1021/acsami.5b12156

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Low-Thermal-Budget Photonic Processing of Highly Conductive Cu Interconnects Based on CuO Nanoinks: Potential for Flexible Printed Electronics

Journal article published in 2016 by Matthew S. Rager, Tolga Aytug, Gabriel M. Veith, Pooran Joshi
This paper was not found in any repository; the policy of its publisher is unknown or unclear.
This paper was not found in any repository; the policy of its publisher is unknown or unclear.

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