Published in
American Institute of Physics, Applied Physics Letters, 9(107), p. 093105, 2015
DOI: 10.1063/1.4930154
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Hybrid stacking structure of electroplated copper onto graphene for future interconnect applications
Journal article published in 2015 by
Ya-Wen Su,
Cen-Shawn Wu,
Chih-Hua Liu,
Hung-Yi Lin,
Chii-Dong Chen
This paper was not found in any repository, but could be made available legally by the author.
Full text: Unavailable
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