Published in
Institute of Electrical and Electronics Engineers, IEEE Transactions on Device and Materials Reliability, 1(15), p. 47-53, 2015
DOI: 10.1109/tdmr.2014.2386319
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Investigation of Barrier Property of Copper Manganese Alloy on Ruthenium
Journal article published in 2015 by
Yin-Hsien Su,
Sze-Ann Wu,
Chia-Yang Wu,
Ying-Lang Wang,
Wen-Hsi Lee
This paper was not found in any repository, but could be made available legally by the author.
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