A diamond tip with included angle of 90° and fillet radius of 45 nm is developed combining precision grinding and focused ion beam. Relatively high speed scratching at 8.4 m/s induced by the developed diamond tip is conducted on silicon (Si) (111) plane using an ultraprecision grinder. Width at the onset of chip formation on a Si wafer is 193 nm. Width and depth at the onset of crack formation are 1125 and 94 nm, respectively. Calculated normal forces at the onset of chip and crack formations are 424 μN and 14 mN, respectively, corresponding to the depth of cut is 44 and 466 nm.