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Proceedings of the 2015 International Power, Electronics and Materials Engineering Conference

DOI: 10.2991/ipemec-15.2015.133

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Research Based on Cohesive Zone Model for Interface Delamination of Waste Plastic Chip

Proceedings article published in 2015 by Xueping Liu, Zufu Pang, Dong Xiang, Yongkai Zhang
This paper is made freely available by the publisher.
This paper is made freely available by the publisher.

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Published version: policy unknown