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American Chemical Society, ACS Applied Materials and Interfaces, 12(4), p. 6927-6934, 2012

DOI: 10.1021/am3020668

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Reduced Workfunction Intermetallic Seed Layers Allow Growth of Porousn-GaN and Low Resistivity, Ohmic Electron Transport

This paper is available in a repository.
This paper is available in a repository.

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Abstract

Porous GaN crystals have been successfully grown and electrically contacted simultaneously on Pt- and Au- coated silicon substrates as porous crystals and as porous layers. By the direct reaction of metallic Ga and NH3 gas through chemical vapor deposition, intermetallic metal-Ga alloys form at the GaN-metal interface allowing vapor-solid-solid seeding and subsequent growth of porous GaN. Current-voltage and capacitance-voltage measurements confirm that the intermetallic seed layers prevent interface oxidation, and give a high quality reduced workfunction contact that allows exceptionally low contact resistivities. Additionally, the simultaneous formation of a lower workfunction intermetallic permits ohmic electron transport to n-type GaN grown using high workfunction metals that best catalyze the formation of porous GaN layers and may be employed to seed and ohmically contact a range of III-N compounds and alloys for broadband absorption and emission.