Published in

Elsevier, Energy and Buildings, (45), p. 274-279

DOI: 10.1016/j.enbuild.2011.11.019

Links

Tools

Export citation

Search in Google Scholar

A contribution to the thermal insulation performance characterization of corn cob particleboards

Journal article published in 2012 by Anabela Paiva, Sandra Pereira, Ana Sa, Daniel Cruz, Humberto Varum ORCID, Jorge Pinto
This paper is available in a repository.
This paper is available in a repository.

Full text: Download

Green circle
Preprint: archiving allowed
Red circle
Postprint: archiving forbidden
Red circle
Published version: archiving forbidden
Data provided by SHERPA/RoMEO

Abstract

An alternative expedite experimental set-up is proposed to evaluate the thermal insulation performance of corn cob particleboards. Testing in situ thermal insulation performance under real thermal and hygrometric conditions, using more realistic sample dimensions, testing simultaneously several samples and monitoring continuously for several days the thermal behavior of a product are some advantages of this proposed technique. Therefore, it has shown to be accurate and versatile. Through this experimental methodology, a parametric thermal insulation study of the corn cob particleboard in which the impact of its thickness on its thermal insulation performance was also possible to perform.