Published in
Institute of Electrical and Electronics Engineers, IEEE Solid-State Circuits Letters, (7), p. 119-122, 2024
DOI: 10.1109/lssc.2024.3375110
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3-D In-Sensor Computing for Real-Time DVS Data Compression: 65-nm Hardware-Algorithm Co-Design
Journal article published in 2024 by
Gopikrishnan R. Nair 
,
Pragnya S. Nalla ,
Gokul Krishnan ,
Anupreetham,
Jonghyun Oh ,
Ahmed Hassan,
Injune Yeo ,
Kishore Kasichainula,
Mingoo Seok ,
Jae-Sun Seo ,
Yu Cao
,
Pragnya S. Nalla ,
Gokul Krishnan ,
Anupreetham,
Jonghyun Oh ,
Ahmed Hassan,
Injune Yeo ,
Kishore Kasichainula,
Mingoo Seok ,
Jae-Sun Seo ,
Yu Cao
This paper was not found in any repository, but could be made available legally by the author.
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