Published in
Procedia Structural Integrity, (17), p. 835-842, 2019
DOI: 10.1016/j.prostr.2019.08.111
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Application of 3D electronic speckle pattern interferometry for the analysis of thermal response in printed circuit boards
Journal article published in 2019 by
Pedro J. Sousa 
,
Fernando Carneiro,
Nuno Viriato Ramos,
Francisco Barros,
Mário A. P. Vaz,
Paulo J. Tavares,
Pedro M. G. P. Moreira
,
Fernando Carneiro,
Nuno Viriato Ramos,
Francisco Barros,
Mário A. P. Vaz,
Paulo J. Tavares,
Pedro M. G. P. Moreira
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