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American Scientific Publishers, Journal of Nanofluids, 1(8), p. 30-40

DOI: 10.1166/jon.2019.1563

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Thermal Enhancement Using Nanofluids on High Heat Dissipation Electronic Components

Journal article published in 2019 by Roger R. Riehl
Distributing this paper is prohibited by the publisher
Distributing this paper is prohibited by the publisher

Full text: Unavailable

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