Published in

2017 Spanish Conference on Electron Devices (CDE)

DOI: 10.1109/cde.2017.7905202

Links

Tools

Export citation

Search in Google Scholar

From materials to devices: Bottom-up integration of nanomaterials onto silicon microstructures for thermoelectric and piezoelectric applications

This paper was not found in any repository; the policy of its publisher is unknown or unclear.
This paper was not found in any repository; the policy of its publisher is unknown or unclear.

Full text: Unavailable

Question mark in circle
Preprint: policy unknown
Question mark in circle
Postprint: policy unknown
Question mark in circle
Published version: policy unknown