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Institute of Electrical and Electronics Engineers, IEEE Transactions on Industrial Electronics, 3(66), p. 2323-2332, 2019

DOI: 10.1109/tie.2018.2823664

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Simplified Thermal Modeling for IGBT Modules with Periodic Power Loss Profiles in Modular Multilevel Converters

Journal article published in 2018 by Yi Zhang ORCID, Huai Wang ORCID, Zhongxu Wang, Yongheng Yang ORCID, Frede Blaabjerg ORCID
This paper is available in a repository.
This paper is available in a repository.

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