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ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1

DOI: 10.1115/ipack2011-52052

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Study of Interfacial Reaction and Electromigration Reliability of Pb-Free Solders With Nickel Iron Barrier Layer

Proceedings article published in 2011 by Minhua Lu, Paul Lauro, Charles Goldsmith
This paper was not found in any repository, but could be made available legally by the author.
This paper was not found in any repository, but could be made available legally by the author.

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Abstract

A study of NiFe alloy as under bump metallurgy (UBM) for Pb-free interconnect has been performed. Intermetallic growth rate of NiFe and SnAg solder is about 10x slower than that of Ni and SnAg solder. The thin and uniform intermetallic compound FeSn2 showed excellent thermal and electromigration stability. By slowing down or stopping the UBM dissolution, NiFe effectively eliminated the early EM fails that are common with Ni UBM. NiFe is an interesting candidate for the chip and substrate surface metallurgy of Pb-free interconnects for high power applications.