Published in
Nihon Kinzoku Gakkai, Materials Transactions, 3(45), p. 695-702, 2004
DOI: 10.2320/matertrans.45.695
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The Microstructure, Thermal Fatigue, and Failure Analysis of Near-Ternary Eutectic Sn-Ag-Cu Solder Joints
Journal article published in 2004 by
Sung K. Kang,
Paul Lauro,
Da-Yuan Shih,
Donald W. Henderson,
Jay Bartelo,
Timothy Gosselin,
Steve R. Cain,
Charles Goldsmith,
Karl Puttlitz,
Tae K. Hwang,
Won K. Choi
This paper is made freely available by the publisher.
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