Copper nanoparticles with an average size of 10 nm are prepared by the sputtering method and are characterized using different techniques, viz., X-ray diffraction spectrum, atomic force microscopy, and transmission electron microscopy. The pool boiling heat transfer characteristics of 0.25%, 0.5%, and 1.0% by weight concentrations of copper nanoparticles dispersed in distilled water and in distilled water with 9.0 wt % of sodium dodecyl sulfate (SDS) are studied. Also the data for the boiling of pure distilled water and water with SDS are acquired. The above data are obtained using commercial seamless stainless steel tube heater with an outer diameter of 9.0 mm and an average surface roughness of 1.09 μm. The experimental results concluded that (i) critical heat flux (CHF) obtained in water with surfactant nanofluids gives nearly one-third of the CHF obtained by copper-water nanofluids, (ii) pool boiling heat transfer coefficient decreases with the increase in the concentration of nanoparticles in water base fluids, and (iii) heat transfer coefficient increases with the addition of 9.0% surfactant in water. Further addition of nanoparticles in this mixture reduces the heat transfer coefficient. (iv) CHF increases nearly 50% with an increase in concentration of nanoparticles in the water as base fluid and nearly 60% in the water with surfactant as base fluid.