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IOP Publishing, Journal of Micromechanics and Microengineering, 3(25), p. 035023

DOI: 10.1088/0960-1317/25/3/035023

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Characterization of the Young’s modulus, residual stress and fracture strength of Cu–Sn–In thin films using combinatorial deposition and micro-cantilevers

Journal article published in 2015 by Wardhana A. Sasangka, Chee Lip Gan, Donny Lai ORCID, Chuan Seng Tan, Carl V. Thompson
Distributing this paper is prohibited by the publisher
Distributing this paper is prohibited by the publisher

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