Published in
American Institute of Physics, Journal of Applied Physics, 5(106), p. 053509
DOI: 10.1063/1.3211985
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Effect of Zn doping on SnAg solder microstructure and electromigration stability
Journal article published in 2009 by
Minhua Lu,
Da-Yuan Shih,
Sung K. Kang,
Charles Goldsmith,
Philip Flaitz
This paper was not found in any repository, but could be made available legally by the author.
Full text: Unavailable
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