Royal Society of Chemistry, Nanoscale, 42(15), p. 16984-16991, 2023
DOI: 10.1039/d2nr06873g
Full text: Unavailable
Vacuum lamination is currently the best encapsulation for perovskite/silicon tandems. Here, we study the lamination process with two different thermoplastic encapsulants, comparing tandem performance and stability, according to IEC standards of certification.