Published in
Springer, Journal of Materials Science: Materials in Electronics, 3(32), p. 3341-3351, 2021
DOI: 10.1007/s10854-020-05082-z
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Influence of doping Ti particles on intermetallic compounds growth at Sn58Bi/Cu interface during solid–liquid diffusion
Journal article published in 2021 by
Nan Jiang,
Liang Zhang 
,
Wei-Min Long,
Su-Juan Zhong,
Lei Zhang
,
Wei-Min Long,
Su-Juan Zhong,
Lei Zhang
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